Nikhilendu Tiwary
Staff Scientist
Staff Scientist
T410 Dept. Electrical Engineering and Automation
Full researcher profile
Phone number
+358466138390
Areas of expertise
Advanced packaging & reliability, 3D heterogeneous integration, MEMS/NEMS, III/V piezoelectric devices, Semiconductor physics
Research groups
- Electronics Integration and Reliability, Staff Scientist
Publications
Josef Stevanus Matondang, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel
2025
Advanced Electronic Materials
Shenyi Liu, Vesa Vuorinen, Xing Liu, Olli Fredrikson, Sebastian Brand, Nikhilendu Tiwary, Josef Lutz, Mervi Paulasto-Krockel
2024
IEEE Transactions on Power Electronics
Nikhilendu Tiwary, Christian Grosse, Michael Kögel, Thilo Windemuth, Glenn Ross, Vesa Vuorinen, Sebastian Brand, Mervi Paulasto-Kröckel
2024
2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings
Obert Golim, Vesa Vuorinen, Glenn Ross, Tobias Wernicke, Marta Pawlak, Nikhilendu Tiwary, Mervi Paulasto-Kröckel
2023
Scripta Materialia
Tarmo Nieminen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel
2023
Micromachines
Nikhilendu Tiwary, Glenn Ross, Vesa Vuorinen, Mervi Paulasto-Kröckel
2023
IEEE Transactions on Electron Devices
F. Emadi, Shenyi Liu, Anton Klami, N. Tiwary, V. Vuorinen, M. Paulasto-Krockel
2022
ASDAM 2022 - Proceedings
Nikhilendu Tiwary, Vesa Vuorinen, Glenn Ross, Mervi Paulasto-Krockel
2022
IEEE Transactions on Components, Packaging and Manufacturing Technology
Obert Golim, Vesa Vuorinen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel
2021
Proceedings of 23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021
Phillip Papatzacos, Nikhilendu Tiwary, Nils Hoivik, Hoang-Vu Nguyen, Avisek Roy, Knut E. Aasmundtveit
2021
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)